At SXSW London, DeepMind’s Demis Hassabis demoed a smart email assistant that adapts to your personal writing style. This tool can categorize new messages, draft quick replies, and even handle basic scheduling chores. Unlike flashy “AI hype,” this assistant is designed for real-world productivity—handling routine inbox tasks so you can focus on higher-value work. DeepMind also emphasized the importance of U.S.–China collaboration to ensure safe, next-generation AI breakthroughs.

Vodafone released its official Glastonbury 2025 app, introducing live friend-location sharing so you never lose track in the crowds. The app also syncs your daily step count to Vodafone’s everyone. Connected charity initiative and includes interactive maps for stage-hopping. Additionally, Vodafone is offering complimentary charging and Wi-Fi at its Connect & Charge tent, ensuring festivalgoers stay powered up during headliners like The 1975 and Olivia Rodrigo.

Applied Digital announced a 15-year deal to lease 250 MW of power to CoreWeave at their Ellendale, North Dakota campus. CoreWeave plans to deploy large-scale NVIDIA GPU arrays for AI training, while Applied Digital secures roughly $7 billion in committed revenue over the lease term. This partnership cements Applied Digital’s position as a leading real-estate investment trust specializing in AI data-center infrastructure.

MediaTek confirmed its inaugural 2 nm system-on-chip will begin tape-out at TSMC in September 2025. Built on TSMC’s N2 process, this SoC aims for 25–30 percent better performance-per-watt compared to current 3 nm designs. It’s slated for late 2025 flagship smartphones and AI-enabled wearables, pushing mobile efficiency and speed to new heights.

At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry film photoresist, designed specifically for ultra-fine circuitry on AI server interposers. These advanced films enable sub-micron patterning in multi-layer semiconductor stacks, improving signal quality and yield for next-generation AI hardware modules. New resin formulations also offer enhanced thermal resilience, a critical factor when packaging high-powered AI accelerators.

Nintendo officially launched the Switch 2 console on June 5, powered by a custom NVIDIA Tegra T239 chip. It sports a 7″ OLED touchscreen and outputs native 4K/60 Hz when docked. Launch titles like Cyberpunk 2077: Ultimate Edition, Deltarune Chapters 3 & 4, and Hogwarts Legacy are optimized for 4K. Early benchmarks show frame rates up to 40 percent higher than the original Switch, thanks to 16 GB of unified memory and enhanced thermal design.

Build a Rocket Boy—founded by former GTA architect Leslie Benzies—has opened sign-ups for “MindsEye’s” closed beta, launching June 15 on PC and Epic Games Store. Set in a dystopian city grappling with AI and climate crises, the game invites players to build custom in-game content, tackle missions, and shape the evolving narrative. Backed by $110 million, “MindsEye” promises a fresh take on open-world gameplay.

At JPCA 2025 in Tokyo, DuPont introduced Sunfort™ TA Series dry film photoresists, engineered for extreme-resolution patterning in multi-layer interposers used by AI server manufacturers. These resists enable sub-micron accuracy, improving signal integrity in stacked semiconductor packages and addressing the growing complexity of AI accelerator hardware.

MediaTek confirmed its new flagship system-on-chip, built on TSMC’s 2 nm process, will enter tape-out in September 2025. This next-gen SoC is expected to boost power efficiency by 25–30 percent and deliver significant performance gains, targeting late-2025 premium smartphones and AI-enabled wearable devices.

Applied Digital signed a 15-year agreement granting CoreWeave 250 MW of power capacity at its Ellendale, North Dakota campus. This deal supports CoreWeave’s plan to deploy massive NVIDIA GPU clusters, contributing an estimated $7 billion in revenue over the contract’s lifetime and reinforcing Applied Digital’s status as a leading AI-focused real-estate investment trust.