052025-06
🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging
At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry film photoresist, designed specifically for ultra-fine circuitry on AI server interposers. These advanced films enable sub-micron patterning in multi-layer semiconductor stacks, improving signal quality and yield for next-generation AI hardware modules. New resin formulations also offer enhanced thermal resilience, a critical factor when packaging high-powered AI accelerators.
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