🎨 Graphic Design: DuPont Showcases Sunfort™ Photoresist for AI Server Packaging

2025-06-03 Category: Design / News Briefs Views(1207) Like(0)

At JPCA 2025 in Tokyo, DuPont introduced Sunfort™ TA Series dry film photoresists, engineered for extreme-resolution patterning in multi-layer interposers used by AI server manufacturers. These resists enable sub-micron accuracy, improving signal integrity in stacked semiconductor packages and addressing the growing complexity of AI accelerator hardware.

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🎨 Graphic Design: DuPont Showcases Sunfort™ Photoresist for AI Server Packaging

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