Welcome aboard!
Always exploring, always improving.

🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging

At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry film photoresist, designed specifically for ultra-fine circuitry on AI server interposers. These advanced films enable sub-micron patterning in multi-layer semiconductor stacks, improving signal quality and yield for next-generation AI hardware modules. New resin formulations also offer enhanced thermal resilience, a critical factor when packaging high-powered AI accelerators.

Like(0) Support the Author
Reproduction without permission is prohibited.FoxDoo Technology » 🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging

If you find this article helpful, please support the author.

Sign In

Forgot Password

Sign Up