At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry film photoresist, designed specifically for ultra-fine circuitry on AI server interposers. These advanced films enable sub-micron patterning in multi-layer semiconductor stacks, improving signal quality and yield for next-generation AI hardware modules. New resin formulations also offer enhanced thermal resilience, a critical factor when packaging high-powered AI accelerators.
🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging
Reproduction without permission is prohibited.FoxDoo Technology » 🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging
You Might Also Like
🎮 Gaming: Diablo IV Season 8 Adds Player-Made Dungeons
🎨 Graphic Design: Firefly Style Lock Freezes Brand Look Across Apps
đź”§ Hardware: Threadripper 9000 Pro Launches with 128 Cores
đź’» Development: Bun 2.1 Vector Search Lands in Core
📱 App: YouTube QuickDub Auto-Translates Shorts In-App
🤖 AI: Llama Guard 3 Realtime Filters Prompts Entirely On-Device
🎮 Gaming: Cyberpunk Orion Teaser Confirms Co‑Op Raids
🎨 Graphic Design: Figma GridScope Auto‑Tunes Responsive Layouts