🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging

2025-06-05 Category: News Briefs Views(467) Like(0)

At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry film photoresist, designed specifically for ultra-fine circuitry on AI server interposers. These advanced films enable sub-micron patterning in multi-layer semiconductor stacks, improving signal quality and yield for next-generation AI hardware modules. New resin formulations also offer enhanced thermal resilience, a critical factor when packaging high-powered AI accelerators.

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🎨 Graphic Design: DuPont Debuts Sunfort™ Photoresist for High-Density AI Packaging

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