At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry-film photoresists, optimized for ultra-fine patterning on multi-layer interposers in AI accelerators. These high-resolution resists enable sub-micron circuit definition and superior thermal endurance—key for next-level semiconductor packaging.
🎨 Graphic Design: DuPont Unveils Sunfort™ Films for AI Server Packaging
Reproduction without permission is prohibited.FoxDoo Technology » 🎨 Graphic Design: DuPont Unveils Sunfort™ Films for AI Server Packaging
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