🎨 Graphic Design: DuPont Unveils Sunfort™ Films for AI Server Packaging

2025-06-07 Category: Design / News Briefs Views(1176) Like(0)

At JPCA 2025 in Tokyo, DuPont introduced its Sunfort™ TA Series dry-film photoresists, optimized for ultra-fine patterning on multi-layer interposers in AI accelerators. These high-resolution resists enable sub-micron circuit definition and superior thermal endurance—key for next-level semiconductor packaging.

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🎨 Graphic Design: DuPont Unveils Sunfort™ Films for AI Server Packaging

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